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IS31AP4913 integrated silicon solution, inc. ? www.issi.com 1 rev.a, 11/17/2011 3d and bass enhancement stereo headphone driver december 2011 general description the IS31AP4913 is a stereo headphone driver designed to allow the removal of the output dc-blocking capacitors for reduced component count and cost. the IS31AP4913 is ideal for small portable electronics where size and cost are in concerns. the IS31AP4913 also features 3d and bass enhancement which can be externally adjusted by a simple rc network. IS31AP4913 is available in qfn-20 (3mm 3mm) packages . it operates from 2.7v to 5.5v over the temperature range of -40c to +85c. features ? no output dc-blocking capacitors ? bass enhancement ? 3d enhancement ? low output noise (8v) ? high snr (102db) ? -92db psrr ? pulse count control serial interface ? thermal protection circuit ? integrated click-and-pop suppression circuitry ? qfn-20 (3mm 3mm) package applications ? cellular handsets and pdas ? notebook pc ? mp3 ? portable gaming typical application circuit 3dl 3dr IS31AP4913 2 3 inr c r_in 0.47 f r r_in 30k 4 outl outr 14 15 cp cn 5 inl 16 19 r r_f2 20k audio in bassl infl bassr infr 2.2 f 1 20 6 7 12 vcc 4.7 f v battery 0.1 f ctrl 100k 11 mode control audio in vss 18 vref 13 4.7 f 2.2 f sgnd 10 17 pgnd r r_f1 20k r r_f3 120k 6.8pf 6.8pf c r_b 22nf r r_b 510k c l_in 0.47 f r l_in 30k c l_b 22nf r l_b 510k r l_f2 20k r l_f1 20k r l_f3 120k r 3d 4.7k c 3d 47nf figure 1 typical application circuit note: the sgnd and pgnd pins of the IS31AP4913 must be routed separately back to the decoupling capacitor in order to provide proper device operation. if the sgnd and pgnd pins are connected directly to each other, the part will function without the risk of fa ilure, but the noise and thd performance do not meet the specifications.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 2 rev.a, 11/17/2011 pin configuration package pin configuration (top view) qfn-20 1 2 3 4 12 13 14 15 5 11 ctrl vcc vref outr outl 3dr 3dl inl inr infr pin description no. pin description 1 infr right channel feedback loop in. 2 inr right channel audio input. 3 3dr 3d control input. 4 3dl 3d control input. 5 inl left channel audio input. 6 bassl left channel bass control out. 7 infl left channel feedback loop in. 8, 9 nc no connection. 10 sgnd signal ground. 11 ctrl shutdown and 3d/bass enable control terminal. 12 vcc supply voltage. 13 vref internal produced supply voltage for charge pump and audio power amplifier. 14 outl left channel audio output. 15 outr right channel audio output. 16 cp charge pump flying capacitor positive terminal. 17 pgnd power ground. 18 vss output from charge pump. 19 cn charge pump flying capacitor negative terminal. 20 bassr right channel bass control out. thermal pad connect to gnd.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 3 rev.a, 11/17/2011 ordering information industrial range: -40c to +85c order part no. package qty/reel IS31AP4913-qfls2-tr qfn-20, lead-free 2500 copyright ? ? ? 2011 ? integrated ? silicon ? solution, ? inc. ? all ? rights ? reserved. ? issi ? reserves ? the ? right ? to ? make ? changes ? to ? this ? specification ? and ? its ? products ? at ? any ? time ? without ? notice. ? issi ? assumes ? no ? liability ? arising ? out ? of ? the ? application ? or ? use ? of ? any ? information, ? products ? or ? services ? described ? herein. ? customers ? are ? advised ? to ? obtain ? the ? latest ? version ? of ? this ? device ? specification ? before ? relying ? on ? any ? published ? information ? and ? before ? placing ? orders ? for ? products. ? integrated ? silicon ? solution, ? inc. ? does ? not ? recommend ? the ? use ? of ? any ? of ? its ? products ? in ? life ? support ? applications ? where ? the ? failure ? or ? malfunction ? of ? the ? product ? can ? reasonably ? be ? expected ? to ? cause ? failure ? of ? the ? life ? support ? system ? or ? to ? significantly ? affect ? its ? safety ? or ? effectiveness. ? products ? are ? not ? authorized ? for ? use ? in ? such ? applications ? unless ? integrated ? silicon ? solution, ? inc. ? receives ? written ? assurance ? to ? its ? satisfaction, ? that: ? a.) ? the ? risk ? of ? injury ? or ? damage ? has ? been ? minimized; ? b.) ? the ? user ? assume ? all ? such ? risks; ? and ? c.) ? potential ? liability ? of ? integrated ? silicon ? solution, ? inc ? is ? adequately ? protected ? under ? the ? circumstances
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 4 rev.a, 11/17/2011 absolute maximum ratings supply voltage, v dd - 0.3v ~ +6.0v voltage at any input pin - 0.3v ~ v dd +0.3v maximum junction temperature, t jmax 150c storage temperature range, t stg - 65c ~ +150c operating temperature range, t a ? 40c ~ +85c esd (hbm) 3kv note: stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress rating s only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the sp ecifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. electrical characteristics v cc = 2.7v ~ 5.5v, t a = 25c, unless otherwise noted. typical value is t a = 25c, v cc = 3.6v. symbol parameter condition min. typ. max. unit v cc supply voltage 2.7 5.5 v i cc quiescent current no load 3 5 ma i sd shutdown current v sdb = 0v 1 a f osc operating frequency 250 khz |v os | output offset voltage v (in) = 0v 1 mv v ih high-level input voltage 1.4 v v il low-level input voltage 0.4 v electrical characteristics (note 1) t a = 25c, v cc = 3.6v, unless otherwise noted. symbol parameter condition min. typ. max. unit p o output power thd+n = 1% r l = 32 ? f = 1khz 30 mw thd+n total harmonic distortion plus noise p o = 20mw r l = 32 ? f = 1khz 0.05 % t wu wake-up time from shutdown 39 ms psrr power supply rejection ratio v p-p = 200mv r l = 32 ? f = 217hz -92 db v p-p = 200mv r l = 32 ? f = 1khz -90 db v no output voltage noise 8 v snr signal-to-noise ratio p o = 30mw thd+n = 1% 102 db t lo mode control low time 1 10 s t hi mode control high time 1 10 s t off ctrl off time for shutdown 200 s note 1: guaranteed by design.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 5 rev.a, 11/17/2011 typical performance characteristic thd+n(%) output power(w) 0.01 20 0.02 0.05 0.1 0.2 0.5 1 2 5 10 1m 2m 5m 10m 20m 50m 100m v cc = 3.0v r l = 32 ? f = 1khz f = 10khz f = 20hz figure 2 thd+n vs. output power thd+n(%) output power(w) 0.01 20 0.02 0.05 0.1 0.2 0.5 1 2 5 10 1m 2m 5m 10m 20m 50m 100m v cc = 4.2v r l = 32 ? f = 10khz f = 20hz f = 1khz figure 4 thd+n vs. output power output voltage(v) 20 20k 50 100 200 500 1k 2k 5k 10k frequency(h z) 1u 20u 2u 3u 5u 7u 10u v cc = 3.6v, 4.2v r l = 32 ? figure 6 noise thd+n(%) output power(w) 0.01 20 0.02 0.05 0.1 0.2 0.5 1 2 5 10 1m 2m 5m 10m 20m 50m 100m v cc = 3.6v r l = 32 ? f = 1khz f = 10khz f = 20hz figure 3 thd+n vs. output power thd+n(%) 20 20k 50 100 200 500 1k 2k 5k 10k frequency(h z) 1 0.01 0.02 0.05 0.1 0.2 0.5 v cc = 3.0v~4.2v r l = 32 ? p o = 20mw figure 5 thd+n vs. frequency psrr(db) 20 20k 50 100 200 500 1k 2k 5k 10k frequency(hz) -120 +0 -100 -80 -60 -40 -20 v cc = 3.6v, 4.2v r l = 32 ? input grounded figure 7 psrr vs. frequency
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 6 rev.a, 11/17/2011 gain(db) 20 20k 50 100 200 500 1k 2k 5k 10k frequency(h z) -4 +10 -2 0 +2 +4 +6 +8 v cc = 3.6v r l = 32 ? bass enable figure 8 gain vs. frequency (bass enable mode)
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 7 rev.a, 11/17/2011 application information general description the IS31AP4913 is a high quality stereo headphone driver with 3d and bass enhancement. operating mode the operating mode is controlled by pulse count control (pcc wire) serial interface. the interface records rising edges of the ctrl pin and decodes them into 4 operating mode (figure 9). if the ctrl pin is pulled to high, receiving one rising edge, the ic starts up and operates in mode 1. if the ctrl pin receives two rising edges, the ic operates in mode 2. if the ctrl pin receives three rising edges, the ic operates in mode 3. if the ctrl pin receives four rising edges, the ic operates in mode 4. mode 1 ? ic starts up, basic operating mode. mode 2 ? ic starts up, enable 3d enhance function. mode 3 ? ic starts up, enable bass enhance function. mode 4 ? ic starts up, enable 3d and bass enhance function. if the ctrl pin is pulled to low last at least 200s, the ic will be into shutdown mode. figure 9 operating mode selected charge pump converter IS31AP4913 integrates a charge pump converter to change input supply voltage (vcc) into a negative voltage providing a 0v reference for the output. the charge pump converter only needs three external components: supply decoupling capacitor, output bypass capacitor and flying capacitor. choose low esr capacitors to ensure the best operating performance and place the capacitors as close as possible to the IS31AP4913. gain setting the input resistors (r in ) and feedback resistors (r f ) set the gain of the amplifier according to equation (1). in f r r ain ? g ? ? ? ? ? ? v v (1) the r f is given by equation (2) below: ? ? 3 2 1 3 2 1 f f f f f f r r r r r r f r ? ? ? ? (2) for example, in figure 1: r f1 = 20k ? , r f2 = 20k ? , r f3 = 120k ? , r in = 30k ? , therefore, ? ? ? ? ? ? ? ? ? k f r 30 120 20 20 120 20 20 1 g 30 30 ? ? ain ? ? ? ? ? ? v v resistor matching is very important in fully differential amplifiers. the balance of the output on the reference voltage depends on matched ratios of the resistors. cmrr, psrr, and cancellation of the second harmonic distortion diminish if resistor mismatch occurs. therefore, it is recommended to use 1% tolerance resistors or better to keep the performance optimized. matching is more important than overall tolerance. resistor arrays with 1% matching can be used with a tolerance greater than 1%. place the input resistors very close to the IS31AP4913 to limit noise injection on th e high-impedance nodes. bass audio enhancement effect when the bass enhancement is enabled, the low frequency input signal will be amplified (figure 8). the cutoff frequency is f b . the signal below f b will be enhanced. f b is given by equation (3): ?? b f f c r r b f 2 1 2 1 ? ? ? (3) for example, in figure 1: r f1 = 20k ? , r f2 = 20k ? , c b = 22nf, so, ?? hz b f nf k k 181 22 20 20 2 1 ? ? ? ? ? ? ? ? the capacitors should have a tolerance of 10% or better, because any mismatch in capacitance causes an impedance mismatch at the startup frequency and below.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 8 rev.a, 11/17/2011 3d audio enhancement effect the 3d audio enhancement effect can be adjusted by the resistor, r 3d . decreasing the resistor size will make the 3d effect more pronounced and decreasing the capacitor size will raise th e cutoff frequency for the effect. the cutoff frequency, f 3d , is determined by equation (4): d d c r d f 3 3 2 1 3 ? ? (4) for example, in figure 1: r 3d = 4.7k ? , c 3d = 47nf, so, hz d f nf k 721 3 47 7 . 4 2 1 ? ? ? ? ? ? setting f 3d below 1khz is recommended to get better 3d enhancement. input capacitor (c in ) the input capacitors and input resistors form a high pass filter with the corner frequency, f c , determined in equation (5). in in c r c f ? 2 1 ? (5) for example, in figure 1: r in = 30k ? , c in = 0.47f, therefore, hz c f f k 11 47 . 0 30 2 1 ? ? ? ? ? ? ? the value of the input capacitor is important to consider as it directly affects the bass (low frequency) performance of the circuit. the capacitors should have a tolerance of 10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. design note component selection the value and esr of the output capacitor for charge pump will affect output ripple and transient performance. a x7r or x5r ceramic capacitor in 2.2 f is recommended. the flying capacitor should be a 2.2f x7r or x5r ceramic capacitor. all capacitors should support at least 10v. pcb layout the decoupling capacitors should be placed close to the vcc pin and the output capacitors should be placed close to the vss pin. the flying capacitor should be placed close to the cn and cp pins. the input capacitors and input resistors should be placed close to the inr and inl pins and the traces must be parallel to prevent noise. the traces of outr and outl pins connected to the headphone should be as short and wide as possible. the recommended width is 0.5mm. trace width should be at least 0.75mm for the power supply and the ground plane. the thermal pad and the pgnd pin should connect directly to a strong common ground plane for heat sinking. the sgnd and pgnd pins of the IS31AP4913 must be routed separately back to the decoupling capacitor in order to provide proper device operation. if the sgnd and pgnd pins are connected directly to each other, the part functions without risk of failure, but the noise and thd performance will not meet the specifications.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 9 rev.a, 11/17/2011 classification reflow profiles profile feature pb-free assembly preheat & soak temperature min (tsmin) temperature max (tsmax) time (tsmin to tsmax) (ts) 150c 200c 60-120 seconds average ramp-up rate (tsmax to tp) 3c/second max. liquidous temperature (tl) time at liquidous (tl) 217c 60-150 seconds peak package body temperature (tp)* max 260c time (tp)** within 5c of the specified classification temperature (tc) max 30 seconds average ramp-down rate (tp to tsmax) 6c/second max. time 25c to peak temperature 8 minutes max. figure 10 classification profile
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 10 rev.a, 11/17/2011 tape and reel information note: all dimensions in millimeters unless otherwise stated.
IS31AP4913 integrated silicon solution, inc. ? www.issi.com 11 rev.a, 11/17/2011 packaging information qfn-20 note: all dimensions in millimeters unless otherwise stated.

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